Infrared COB (Chip-on-Board) LED is a high-density light source technology that integrates multiple infrared LED chips directly on a substrate and has broad application prospects. The following is a summary of its key features:
Substrate material: Materials with high thermal conductivity, such as ceramic or aluminum substrates, are usually used to optimize heat dissipation.
Packaging material: Silicone or special resin is selected to prevent ordinary epoxy resin from absorbing infrared light and ensure high transmittance (such as 850nm or 940nm wavelength).
Chip layout: Multiple chips are closely arranged and connected by gold wire bonding or flip chip technology to improve power density and uniformity.
High power density: Due to the integration of multiple chips, it is very suitable for a wide range of infrared lighting applications (such as security supplementary lighting).
Excellent heat dissipation performance: The substrate directly conducts heat, prolongs product life and maintains stability.
Uniform light emission: Reduces light spots, especially suitable for precision sensing or medical applications.
Compact design: Simplifies the structure of the optical system and is suitable for scenes with limited space.
Wavelength range: Common wavelengths are 850nm (slight red burst) or 940nm (invisible), which are suitable for different application scenarios.
Optical power: It can reach tens of watts and needs to be matched with efficient heat dissipation design.
Beam angle: It can be adjusted by lens or reflector (such as wide-angle security or narrow-angle detection).
Driving mode: Mainly constant current drive, some scenes may require pulse adjustment (such as energy saving or avoiding overheating).
Security monitoring: As a night vision fill light, it provides uniform infrared lighting for the camera.
Medical equipment: Used in infrared physiotherapy, biological detection and other occasions that require high-power stable light sources.
Industrial sensing: Applied in machine vision, infrared temperature measurement or gas detection and other fields.
Smart home: Supports functions such as face recognition and gesture control (such as smart speakers).
Special uses: Including scientific research, military or communication fields (such as Li-Fi).
Heat dissipation design: It is necessary to use heat sinks, fans or thermoelectric cooling to prevent wavelength deviation or efficiency loss.
Process yield: Chip spacing and bonding process will affect heat distribution and reliability.
Spectral consistency: Strict sorting is required because wavelength differences between multiple chips may cause spectral broadening.
Cost balance: Although high thermal conductivity substrates increase costs, system integration may be more economical.
Major suppliers: Including OSRAM, ams-OSRAM, Seoul Semiconductor, etc.
Trend: Demand in smart security, autonomous driving (LiDAR), and medical fields are driving the growth of this market.
COB vs. SMD array: COB is more suitable for high-density/high-power applications, while SMD is more flexible but has weaker heat dissipation performance.
Traditional infrared lamps (halogen): Compared with traditional infrared lamps, COB LEDs are more energy-efficient and have a longer lifespan, although the initial cost is higher.
Summary Infrared COB LEDs have shown significant advantages in security, medical and industrial fields due to their high integration, excellent heat dissipation performance and uniformity. With the continuous advancement of heat dissipation technology and packaging processes, its application range is expected to expand further and become one of the core choices for efficient infrared solutions.
